Lead frame of optical coupling device and manufacturing method of same

A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header section...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAKURA HIDEYA, KUSUDA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header sections for mounting thereon the light-receiving element are aligned, and (c) a connecting section for connecting the light-emitting side section and the light-receiving side section in parallel into one body. The light-emitting side section and the light-receiving side section are integrated via a connecting section at which a V groove is formed for facilitating the folding of the lead frame. As a result, it is possible to provide a low-cost lead frame of an optical coupling device with a small number of components can be realized, in a simplified manner, and a manufacturing method of the optical coupling device.