Paste providing method, soldering method and apparatus and system therefor

A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate hav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUKASAWA HIDEYUKI, SHIRAI MITSUGU, MURAKAWA TOSHITAKA, YOSHIKAWA FUMIO, HAMAMURA KENICHI, SASAKI HIDEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES SOLDERING OR UNSOLDERING STAMPS TRANSPORTING TYPEWRITERS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.