Electronic package with optimized lamination process

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperatur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FARQUHAR DONALD S, KLODOWSKI MICHAEL J, HERARD JAMES D, QUESTAD DAVID, WOAN DER-JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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