Electronic package with optimized lamination process

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.