SINGLE-MELT ENHANCED RELIABILITY SOLDER ELEMENT INTERCONNECT

A method of joining first and second substrates through a solder element interconnect, the method including the steps of forming solder elements, such as solder balls, in a first array on a first substrate, forming pads of solder paste in a second array on a second substrate wherein the first and se...

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Bibliographische Detailangaben
Hauptverfasser:	JACKSON RAYMOND A, FAROOQ MUKTA G
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of joining first and second substrates through a solder element interconnect, the method including the steps of forming solder elements, such as solder balls, in a first array on a first substrate, forming pads of solder paste in a second array on a second substrate wherein the first and second arrays are mirror images of one another, establishing a standoff element on one of the first or second substrates, assembling the first and second substrates such that each of the solder elements on the first substrate are embedded in each of the solder paste pads and the standoff element is interposed between the first and second substrates, heating the first and second substrates at a preferred temperature to cause melting of the solder elements and the solder pads into single solder elements, wherein the standoff controls the separation distance between the first and second substrates.