Process for the production of an optoelectronic semiconductor component

A process for the production of an optoelectronic semiconductor component, and the component formed by the process. The component includes a chip which is provided with electrical terminals, and being fitted in a package which functionally consists of at least a base body and a top, both consisting of glass. The process includes the steps of: a) producing and preparing two sintered glass preforms (glass bodies); b) applying adhesive to the preform surfaces to be connected; c) fixing the two preforms in a tool; d) producing a mechanical connection of the two glass bodies to the electrical terminals. Alternatively, further processes are described.