Chamfer device for cutting packaging materials

A chamfer cutting device for cutting packaging materials (9) comprises a die (1) and a knife part which has a plurality of knives (2). The die (1) can be moved toward the knife part in order to carry out a cut. The knives (2) are arranged individually in the knife part in a force-dependent manner in such a way that their position with respect to the tool plate (4) varies in a defined way as a function of the force produced by contact with the packaging material (9) or the die (1). In the event of contact between the knife (2) and the die (1), a force acts on the knife (2) which does not exceed a predefined maximum force. The chamfer cutting device has the advantage that the die (1) can be guided right up to the knives (2).