DOPED SILICON DEPOSITION PROCESS IN RESISTIVELY HEATED SINGLE WAFER CHAMBER

A method for depositing doped polycrystalline or amorphous silicon film. The method includes placing a substrate onto a susceptor. The susceptor includes a body having a resistive heater therein and a thermocouple in physical contact with the resistive heater. The susceptor is located in the process...

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Bibliographische Detailangaben
Hauptverfasser: CHEN STEVEN A, DRAGOJLOVIC ZORAN, WANG SHULIN, LUO LEE, SANCHEZ ERROL, TAO XIANZHI, FU LI
Format: Patent
Sprache:eng
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Zusammenfassung:A method for depositing doped polycrystalline or amorphous silicon film. The method includes placing a substrate onto a susceptor. The susceptor includes a body having a resistive heater therein and a thermocouple in physical contact with the resistive heater. The susceptor is located in the process chamber such that the process chamber has a top portion above the susceptor and a bottom portion below the susceptor. The method further includes heating the susceptor. The method further includes providing a process gas mix into the process chamber through a shower head located on the susceptor. The process gas mix includes a silicon source gas, a dopant gas, and a carrier gas. The carrier gas includes nitrogen. The method further includes forming the doped silicon film from the silicon source gas.