Methods of forming microstructure devices

The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over th...

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Bibliographische Detailangaben
Hauptverfasser: CHINN JEFFREY D, LEUNG TOI YUE BECKY
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.