Crosslinked pressure sensitive adhesive compositions, and adhesive articles based thereon , useful in high temperature applications
Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures. |
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