Crosslinked pressure sensitive adhesive compositions, and adhesive articles based thereon , useful in high temperature applications

Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.

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Bibliographische Detailangaben
Hauptverfasser: ENGLE LORI P, ZHOU ZHIMING
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.