Semiconductor integrated circuit

Semiconductor integrated circuit

Bump areas for signals are spread on the upper and lower positions with respect to the Vdd and Vss lines in the I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread into two directions. Greater number of I/O buffers can be disposed without increasi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKABAYASHI TSUTOMU, MORIZANE SHIZUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:Bump areas for signals are spread on the upper and lower positions with respect to the Vdd and Vss lines in the I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread into two directions. Greater number of I/O buffers can be disposed without increasing the size of the semiconductor integrated circuit.