Reworkable encapsulant

The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and reworkably removing the same to and from the electronic device module. In one embodiment, a coating of a f...

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Bibliographische Detailangaben
1. Verfasser:	LUNCEFORD BRENT D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and reworkably removing the same to and from the electronic device module. In one embodiment, a coating of a fluorinated polymer solution is applied to at least a portion of an electronic device module. The module is then baked to operably fix to it the fluorinated polymer coating.