System and method for suppressing RF resonance in a semiconductor package

System and method for suppressing RF resonance in a semiconductor package

A system and method for optimizing the output of a semiconductor die is described. A lid for a semiconductor package includes a radio frequency resonance dampening material which can be repatterned in real time to minimize resonance reflection within the package. The patterning may take the form of...

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Hauptverfasser: DAUTARTAS MINDAUGAS F, FREUND JOSEPH M, GEARY JOHN M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator DAUTARTAS MINDAUGAS F
FREUND JOSEPH M
GEARY JOHN M
description A system and method for optimizing the output of a semiconductor die is described. A lid for a semiconductor package includes a radio frequency resonance dampening material which can be repatterned in real time to minimize resonance reflection within the package. The patterning may take the form of structures within the material or different sections of the material having differing resistivities to resonance reflection. Upon determing that acceptable resonance reflection has been achieved, the material is cured.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title System and method for suppressing RF resonance in a semiconductor package
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