System and method for suppressing RF resonance in a semiconductor package
A system and method for optimizing the output of a semiconductor die is described. A lid for a semiconductor package includes a radio frequency resonance dampening material which can be repatterned in real time to minimize resonance reflection within the package. The patterning may take the form of...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A system and method for optimizing the output of a semiconductor die is described. A lid for a semiconductor package includes a radio frequency resonance dampening material which can be repatterned in real time to minimize resonance reflection within the package. The patterning may take the form of structures within the material or different sections of the material having differing resistivities to resonance reflection. Upon determing that acceptable resonance reflection has been achieved, the material is cured. |
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