Module having integral surface acoustic wave circuits and method of manufacturing the same
A module for receiving a function circuit and a method of manufacturing such module. In one embodiment, the module includes: (1) an input surface acoustic wave (SAW) circuit, located within the module and couplable to an input of the function circuit, that conditions an input signal provided to the...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A module for receiving a function circuit and a method of manufacturing such module. In one embodiment, the module includes: (1) an input surface acoustic wave (SAW) circuit, located within the module and couplable to an input of the function circuit, that conditions an input signal provided to the function circuit and (2) an output SAW circuit, located within the module and couplable to an output of the function circuit, that conditions an output signal produced by the function circuit. |
|---|