Flat flexible circuit interconnections

A system and method are provided for interconnecting the generally parallel conductors of a pair of flat circuits out of sequential order relative to each other. The system includes a pair of flat circuits each having a plurality of generally parallel conductors covered by a dielectric film. A pattern of windows are formed in the film of each circuit to expose the conductors at different locations longitudinally thereof. The patterns of windows of the two circuits are coincident with each other when the flat circuits are overlapped with each other and with the circuits oriented so that the conductors of the circuits are at angles relative to each other. The conductors of the respective circuits are electrically connected through the windows.