Method and apparatus for restricting process fluid flow within a showerhead assembly

A system and method are disclosed for restricting process fluid flow within a showerhead assembly which includes a process chamber (12) with a showerhead assembly (20) disposed therein. The showerhead assembly (20) has a blocking assembly (24) disposed within the showerhead assembly (20) for restric...

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Bibliographische Detailangaben
1. Verfasser:	ROSE DAVID JAY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A system and method are disclosed for restricting process fluid flow within a showerhead assembly which includes a process chamber (12) with a showerhead assembly (20) disposed therein. The showerhead assembly (20) has a blocking assembly (24) disposed within the showerhead assembly (20) for restricting the flow of process fluid within the showerhead assembly (20). Restricting the flow of process fluid within the showerhead effectively restricts the flow of process fluid exiting a center portion (30) of showerhead assembly (20), directed at a substrate wafer (16) disposed within the process chamber (12).