Compound machining device and friction stir bonding method
A machining device comprising five axial kinetic coordinate systems that can be controlled simultaneously, the three axes of which are linear moving axes and the two axes of which are rotary axes, with one axis of the five axes provided with a tool rotating function, said machining device equipped w...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A machining device comprising five axial kinetic coordinate systems that can be controlled simultaneously, the three axes of which are linear moving axes and the two axes of which are rotary axes, with one axis of the five axes provided with a tool rotating function, said machining device equipped with a cutting tool 51 and a friction stir bonding tool 52. The current value observed when a large-diameter portion of said tool 52 contacts the work object is set in advance, and by observing the torque current of the rotary shaft of the tool 52 during friction stir bonding, the insertion depth of the tool 52 can be controlled by maintaining the observed torque current above the preset current value, thus providing a good bond. A single device can provide both the cutting and the bonding. The present invention enables to cut down equipment cost, installation space, plant area, lead time and production cost. |
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