Composition and method for polishing semiconductors

An aqueous polishing composition for chemical mechanical polishing of semiconductor devices of silica and circuits of aluminum, titanium or titanium nitride; wherein said aqueous composition includes, an oxidizing agent, an inhibitor of a polyalkyleneimine, and a pH buffer, and a method for polishin...

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Bibliographische Detailangaben
Hauptverfasser: SHEN JAMES, LUO QIULIANG
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An aqueous polishing composition for chemical mechanical polishing of semiconductor devices of silica and circuits of aluminum, titanium or titanium nitride; wherein said aqueous composition includes, an oxidizing agent, an inhibitor of a polyalkyleneimine, and a pH buffer, and a method for polishing a semiconductor device by applying the polishing composition at an interface between a polishing pad and the semiconductor device.