Polymer stud grid array and method for producing such a polymer stud grid array
A first wiring layer and metallized plated-through holes are formed in/on a substrate. A substrate layer is then applied to the top of the substrate by injection molding, during which an injected material passes through the plated-through holes, resulting in polymer studs being produced on an unders...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A first wiring layer and metallized plated-through holes are formed in/on a substrate. A substrate layer is then applied to the top of the substrate by injection molding, during which an injected material passes through the plated-through holes, resulting in polymer studs being produced on an underside of the substrate. A second wiring layer, formed on the substrate layer, is electrically conductively connected to the first wiring layer by blind plated-through holes, and hence to external connections on the polymer studs by the plated-through holes. |
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