Wire bonding method and wire bonding apparatus

A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined and a wire feeding hole being open to the pressing surface; a wire feeding means for feeding the wire to an outside of the bonding tool through the wire feeding hole; and an att...

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Bibliographische Detailangaben
1. Verfasser:	ARAKAWA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined and a wire feeding hole being open to the pressing surface; a wire feeding means for feeding the wire to an outside of the bonding tool through the wire feeding hole; and an attracting and holding means for applying an attraction force to a wire tip end part that is protruded from the wire feeding hole, thereby to bend and hold the wire tip end part towards the pressing surface.