Optical package with dual interconnect capability

Optical package with dual interconnect capability

An electronic package is adapted to be coupled in a single-ended configuration and in a differential configuration. The package provides a characteristic impedance of approximately 50 ohms when configured in a single-ended mode and also when configured in the differential mode. The package includes...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PLOURDE JAMES KEVIN, FU HUI, BOSCH FRIDOLIN LUDWIG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package is adapted to be coupled in a single-ended configuration and in a differential configuration. The package provides a characteristic impedance of approximately 50 ohms when configured in a single-ended mode and also when configured in the differential mode. The package includes multiple terminals, which are coupled to ground, S, and {overscore (S)}. The package may be configured externally by the user for either mode. The package may also be fabricated to be coupled in either the differential mode or single-ended mode for user specific applications.