IMPROVED METHODS AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) OF A SEMICONDUCTOR WAFER

Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.

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Bibliographische Detailangaben
Hauptverfasser:	HEDGE SURI G, WISE MICHAEL LESTER, STEPHENS JEREMY KASPAT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.