Resin composition and injection-molded article

A resin composition containing: (A) an ethylene-alpha-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 860 to 920 kg/m3, and a highest melting peak temperature of from 50° C. to 110° C.; (B) an ethylene homopolymer or ethylene-alpha-olefin copolymer having a me...

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI SHIGEICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	A resin composition containing: (A) an ethylene-alpha-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 860 to 920 kg/m3, and a highest melting peak temperature of from 50° C. to 110° C.; (B) an ethylene homopolymer or ethylene-alpha-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 910 to 980 kg/m3, and a highest melting peak temperature of from 110° C. to 135° C.; and (C) a low-density polyethylene having a melt flow rate of from 0.5 to 100 g/10 min, and a swell ratio of from 1.3 to 2.0, provides a molded article superior in mold release properties, flexibility and heat resistance, particularly when used in injection molding.