Connecting structure for covered wires
A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper resin tips 13 is provided, on a periphery of the butt face, with a projection 13b. On the other hand, the lower resin tip 14 has a recess 14b formed on a periphery of the butt face, for engagement with the projection 13b. Owing to the provision of the projection 13b and the recess 14b, it is possible to exclude a possibility that the upper resin tip 13 deviates from the lower resin tip 14 during the ultrasonic oscillation. |
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