Printed circuit board and wire arrangement method thereof

The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Huang, Haiju, Wu, Chunmei, Li, Jing, Feng, Chenxia
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.