Method for inspecting pattern defects

In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of sec...

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Bibliographische Detailangaben
Hauptverfasser: Huang, Te-Chih, Huang, Jiann Yuan, Chang, Chia-Fong, Chen, Ju-Ying, Lin, Hua-Tai, Lee, Che-Yen, Sun, Chi-Yuan
Format: Patent
Sprache:eng
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Zusammenfassung:In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.