RFID assembly and assembly method thereof

An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at...

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Bibliographische Detailangaben
Hauptverfasser: Muller, Paul, Muller, Pierre, Coulot, Thomas, MacDougall, Arthur Hugh, Entringer, Christophe
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.