Semiconductor substrate and manufacturing method thereof

Semiconductor substrate and manufacturing method thereof

A semiconductor substrate includes a first circuit structure and a second circuit structure. The first circuit structure includes a first circuit layer. The first circuit layer includes a first dielectric layer. The second circuit structure includes a second circuit layer. The second circuit layer i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Hu, Dyi-Chung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor substrate includes a first circuit structure and a second circuit structure. The first circuit structure includes a first circuit layer. The first circuit layer includes a first dielectric layer. The second circuit structure includes a second circuit layer. The second circuit layer includes a second dielectric layer. The second circuit structure is disposed on the first circuit structure and is electrically connected to the first circuit structure to constitute the semiconductor substrate. A manufacturing method of the semiconductor substrate is also provided.