Cooling device, a receptacle assembly, a system and a printed board assembly

A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and at least one heat pipe that is in thermal contact with the heat sink, wherein the at least one heat pipe comprises a thermal contact area that is configured for thermal contact with a heat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Saaidi, Samir, Lundmark, Gustav, Myhre, Mikkel
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and at least one heat pipe that is in thermal contact with the heat sink, wherein the at least one heat pipe comprises a thermal contact area that is configured for thermal contact with a heat generating component, and the at least one heat pipe is configured in a shape that provides mechanical spring properties. Such a heat generating component may comprise a pluggable module. Also disclosed is a receptacle assembly comprising a frame having an interior cavity configured for accommodating a heat generating component and having an opening for receiving the heat generating component, characterized in that it comprises a cooling device. Disclosed is also a system comprising a receptacle assembly, and a printed board assembly (PBA) comprising a receptacle assembly.