Plating apparatus and cleaning method of contact member of plating apparatus

Plating apparatus and cleaning method of contact member of plating apparatus

A plating apparatus 1000 includes a plating tank, a substrate holder 20, a rotation mechanism, an elevating mechanism, a contact member 40, and a cleaning device 50 configured to clean the contact member 40. The cleaning device 50 includes a pivot shaft 51, a first arm 53, a second arm 54, and a noz...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chang, Shao Hua, Seki, Masaya, Tomita, Masaki
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:A plating apparatus 1000 includes a plating tank, a substrate holder 20, a rotation mechanism, an elevating mechanism, a contact member 40, and a cleaning device 50 configured to clean the contact member 40. The cleaning device 50 includes a pivot shaft 51, a first arm 53, a second arm 54, and a nozzle 55 that includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact member 40 cleans the contact member 40.