Method and device for adhesively bonding substrates in film form and composite body obtained thereby

The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surf...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Gierlings, Michael, Kinzelmann, Hans-Georg
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.