Fan-out LED packaging structure and method

The present disclosure provides fan-out LED packaging structures and methods. The fan-out LED packaging structure at least comprises: an LED wafer, a packaging layer, a first redistribution layer, an IC control chip module, and a second redistribution layer. The LED wafer and the IC control chip mod...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Xue, Xingtao, Tsai, Hanlung, Lin, Chengchung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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