Fan-out LED packaging structure and method

The present disclosure provides fan-out LED packaging structures and methods. The fan-out LED packaging structure at least comprises: an LED wafer, a packaging layer, a first redistribution layer, an IC control chip module, and a second redistribution layer. The LED wafer and the IC control chip module use metal wires of the first and second redistribution layers and metal-plated holes of the packaging layer to lead out and to control the LED wafer and the IC control chip. The present disclosure also provides fan-out LED packaging methods. The methods adopt metal plating in place of wire bonding, and adopt PI dielectric layers and rewiring layers in place of a base substrate, thus effectively reducing the LED package size.