Sensor having stress relieving support structure

An example transducer includes an upper magnetic circuit assembly including an upper excitation ring, a lower magnetic circuit assembly including a lower excitation ring, and a proof mass assembly positioned between the upper and lower magnetic circuit assemblies. A coefficient of thermal expansion (CTE) of the proof mass assembly is lower than a CTE of each of the upper and lower excitation rings. The transduces also includes an outer support structure coupled to an outer surface of each of the upper and lower excitation rings, and the outer support structure includes at least one cutout configured to reduce a circumferential stiffness of the outer support structure.