Singulation of microelectronic components with direct bonding interfaces

Singulation of microelectronic components with direct bonding interfaces

Disclosed herein are structures and techniques related to singulation of microelectronic components with direct bonding interfaces. For example, in some embodiments, a microelectronic component may include: a surface, wherein conductive contacts are at the surface; a trench at a perimeter of the sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liff, Shawna M, Tsunoda, Nagatoshi, Krishnatreya, Bhaskar Jyoti, Agraharam, Sairam
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein are structures and techniques related to singulation of microelectronic components with direct bonding interfaces. For example, in some embodiments, a microelectronic component may include: a surface, wherein conductive contacts are at the surface; a trench at a perimeter of the surface; and a burr in the trench.