Pad removal method and device

A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Wang, Sheng-Chen, Chen, Chunhung
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the width of the pad.