Topological heatsink
A heat sink for a heat-generating component of an electronic device has a backbone panel with opposing upper and lower surfaces. Cooling elements extend away from the upper surface of the heat sink and terminate in upper ends that define a topological surface. Thermally conducting structures extend...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A heat sink for a heat-generating component of an electronic device has a backbone panel with opposing upper and lower surfaces. Cooling elements extend away from the upper surface of the heat sink and terminate in upper ends that define a topological surface. Thermally conducting structures extend away from the lower surface of the heat sink and terminate in tips that define a surface that is complementary to the surface of the heat-generating component of the electronic device. |
---|