Topological heatsink

A heat sink for a heat-generating component of an electronic device has a backbone panel with opposing upper and lower surfaces. Cooling elements extend away from the upper surface of the heat sink and terminate in upper ends that define a topological surface. Thermally conducting structures extend...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Smith, Michael James
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A heat sink for a heat-generating component of an electronic device has a backbone panel with opposing upper and lower surfaces. Cooling elements extend away from the upper surface of the heat sink and terminate in upper ends that define a topological surface. Thermally conducting structures extend away from the lower surface of the heat sink and terminate in tips that define a surface that is complementary to the surface of the heat-generating component of the electronic device.