Stamp-forming system and method

A stamp-forming system includes a lower die formed of elastomeric material and having lower die lateral sides. In addition, the stamp-forming system includes a die wall configured to encircle the lower die lateral sides, and move vertically relative to the lower die. Also included in the stamp-forming system is an upper die configured to move between an open position in which the upper die is separated from the die wall and the lower die, and a clamped position in which the upper die is in contact with the die wall and applying clamping pressure to a blank against the lower die, to thereby form the blank into a formed article. The die wall is sized and configured to prevent lateral expansion of the lower die when the lower die is vertically compressed by the clamping pressure applied by the upper die.