Solid-state image sensor and electronic apparatus

This technology relates to a solid-state image sensor configured to make smaller the chip size of a CIS that uses an organic photoelectric conversion film, and to an electronic apparatus. A solid-state image sensor according to a first aspect of this technology is characterized in that it includes a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Matsumoto, Akira, Tayanaka, Hiroshi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:This technology relates to a solid-state image sensor configured to make smaller the chip size of a CIS that uses an organic photoelectric conversion film, and to an electronic apparatus. A solid-state image sensor according to a first aspect of this technology is characterized in that it includes a first substrate and a second substrate stacked one on top of the other and a first organic photoelectric conversion film formed on the first substrate and that a latch circuit is formed on the second substrate. This technology may be applied to back-illuminated CISs, for example.