Standalone and scalable cooling infrastructure

Multiple systems for providing liquid and closed loop air cooling for Information Technology (IT) components is disclosed. The systems for cooling IT include a first module with at least one dry cooler, a second module with at least one liquid heat exchanger device, and a third module with an air to...

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Bibliographische Detailangaben
Hauptverfasser:	Duncan, Tyler Baxter, Middleton, Anthony
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Multiple systems for providing liquid and closed loop air cooling for Information Technology (IT) components is disclosed. The systems for cooling IT include a first module with at least one dry cooler, a second module with at least one liquid heat exchanger device, and a third module with an air to liquid exchange section that includes at least one air to liquid exchanger that provides air cooling to one or more IT units. The system may also include a fourth module that includes the one or more IT units.