Connecting electronic components to substrates

An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the firs...

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Bibliographische Detailangaben
1. Verfasser:	Marinov, Val
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the first substrate; and an electronic component between the second substrate and the first substrate and electrically connected to one or more of the conductive features.