Die pickup module and die bonding apparatus including the same

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a...

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Bibliographische Detailangaben
Hauptverfasser:	Park, Young Gun, Kim, Jung Sub, Min, Dae Ho, Jung, Sang Hoon, Lee, Kang San, Choi, Dae Seok, Choi, Eui Sun, Seok, Seung Dae, Jeong, Chang Bu, Lee, Min Gu, Park, Jong Sung
Format:	Patent
Sprache:	eng
Schlagworte:	CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.