Encapsulation film having moisture adsorbent and metal mesh layer

Encapsulation film having moisture adsorbent and metal mesh layer

Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsul...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ryu, Jae Seol, Jang, Se Hyun, Mok, Yeong Bong, Ryu, Dong Hwan, Shin, Moon Cheol
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
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Beschreibung
Zusammenfassung:Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.