Packages with multiple types of underfill and method forming the same

Packages with multiple types of underfill and method forming the same

A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third pac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hou, Shang-Yun, Huang, Kuan-Yu, Huang, Sung-Hui, Kuo, Li-Chung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.