Multi-layer ceramic electronic component and circuit board

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape; and external electrodes each including a base layer, a conductive resin layer, and first and second conductive layers. A conductive filler includes a core portion and a silver coating film made of silver and covering the core portion. In a cross-section parallel to the first and second axes, when a straight line parallel to the first axis is drawn to pass through a range distant from a base end portion, and when a thickness of the first conductive layer along the line is a conductor thickness, and the sum of lengths of the silver coating film along the line in all the conductive fillers on the line is a total thickness of silver coating, a ratio of the conductor thickness to the total thickness of silver coating is 2 or more and 10 or less.