Electric component with pad for a bump and manufacturing method thereof

Electric component with pad for a bump and manufacturing method thereof

A bump pad enclosure providing an improved reliability of a bump connection is provided. The bump pad enclosure comprises an electrode pad, a UBM and a first shield. The first shield covers at least a first perimeter area of the electrode pad. The first shield is provided and configured to shield th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Bywalez, Robert Felix, Steinhaeusser, Ute, Schmiedgen, Monika
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A bump pad enclosure providing an improved reliability of a bump connection is provided. The bump pad enclosure comprises an electrode pad, a UBM and a first shield. The first shield covers at least a first perimeter area of the electrode pad. The first shield is provided and configured to shield the first perimeter area from a detrimental influence of the environment.