Semiconductor assembly with multi-device cooling
A semiconductor device assembly includes a cooling system, a plurality of semiconductor packages, each including a semiconductor die and an encapsulant body, and a multi-device thermal interface interposed between the plurality of semiconductor packages and the cooling system, wherein the semiconduc...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device assembly includes a cooling system, a plurality of semiconductor packages, each including a semiconductor die and an encapsulant body, and a multi-device thermal interface interposed between the plurality of semiconductor packages and the cooling system, wherein the semiconductor packages are each configured as surface mount devices, and wherein the multi-device thermal interface thermally couples each of the semiconductor packages to the cooling system. |
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