Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof

A chip package including a semiconductor chip is provided. The chip package may include a packaging material at least partially around the semiconductor chip with an opening extending from a top surface of the packaging material to the semiconductor chip and/or to an electrical contact structure contacting the semiconductor chip, and a thermally conductive material in the opening, wherein the thermally conductive material is configured to transfer heat from the semiconductor chip to an outside, wherein the thermally conductive material extends laterally at least partially over the top surface of the packaging material.