Imaging unit and imaging device

An imaging unit (50) includes an imaging sensor chip (1), a package substrate (2) on which the imaging sensor chip (1) is mounted, an adhesion member (5) that adheres a back surface of the imaging sensor chip (1) opposite to a light receiving surface (10) and a bottom surface (2d) that is a surface...

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Bibliographische Detailangaben
1. Verfasser:	Mayumi, Kazuya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An imaging unit (50) includes an imaging sensor chip (1), a package substrate (2) on which the imaging sensor chip (1) is mounted, an adhesion member (5) that adheres a back surface of the imaging sensor chip (1) opposite to a light receiving surface (10) and a bottom surface (2d) that is a surface of the package substrate (2) on which the imaging sensor chip (1) is mounted to each other, and a circuit board (52) that is adhered to a back surface of the package substrate (2) opposite to the bottom surface (2d). The adhesion member (5) is composed of a central adhesion part (5a) adhered to a central portion (1A) of the imaging sensor chip (1) and a peripheral adhesion part (5b) adhered to a peripheral portion (1B) of the imaging sensor chip (1) that is separated from the central portion (1A).